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(Physicochemical performance of nanostructured Ti and AlN hydrophobic films grown by cold plasma on surfaces of pin type porcelain insulators)

Abstract

The mechanical strength and the dielectric properties of ceramic insulators are essential properties to support the electricity distribution networks. However, both the moisture and the pollutant content in the atmosphere may become harmful and cause failures in the power supply by increasing its electrical current leakage. The insulating glazing has high affinity with the resulting water from the interaction of the glass surface with atmosphere. In this study, the deposition of aluminum nitride films was carried out on the glazed samples of ceramic electrical insulators, via pulsed DC magnetron sputtering plasma, and with a mixture of argon and nitrogen gas and Ti on pin type insulators for 15 kV voltage class. The morphology of the films and the performance of insulators were measured by SEM-FEG/EDS, AFM, maximum RMS leakage current and degree of hydrophobicity. The performance of deposited films by the degree of hydrophobicity measured in samples reduced from CM6 to CM4 with AlN, and CM7 to CM3 with Ti layer. The maximum RMS leakage current measured with and without the insulating film based on nanometric Ti was higher in devices without the pr otection, reaching measured values of 5 mA and with shutdown of computerized measuring system (after 3 days in Sauípe and 3 months in Pituba) as a consequence of having overcome the short circuit withdrawal period laid down in software (surges exceeding 300 mA). With the deposition of the films in 7 insulators, changes in two of these, with peaks of maximum leakage current achieving 2.4 mA, in the field were observed. Most insulators analyzed had the variations in RMS leakage current between 0.2 and 2 mA in the measurement period, in adverse conditions of weather (rain and differ ent wind speeds).

Keywords:
porcelain electrical insulator; cold plasma; hydrophobicity; contact angle; AlN; Ti; physicochemical performance

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