This research was aimed to obtain biodegradable polymeric films with antifungal action against Aspergillus niger, through the addition of copper oxide nanoparticles (CuO-NPs) in the commercial polymer (Ecoflex®) and to evaluate its mechanical, morphological, biodegradation, and copper release properties. The microbiological results showed that the films with 4 wt% CuO-NPs inhibited 97.57% the growth of the fungus growth of 1×105 spores·mL-1 compared to the control. The morphological characterization revealed that the CuO-NPs presented irregular form with particles size of 50 to 400 nm and the XRD showed characteristic peaks of copper oxide. The addition of CuO-NPs to Ecoflex® provided increased maximum and rupture tension, strain, and elasticity modulus the obtained films with 1 wt% CuO-NPs and did not alter the biodegradability of the films. It can be said that, through the addition of CuO-NPs to Ecoflex®, it was possible to add antifungal activity for Aspergillus niger without compromising its biodegradability, meeting the safety standards established by legislation regarding the release of copper.
Keywords:
CuO-NPs; Ecoflex®; antimicrobial activity; antimicrobial packaging