ABSTRACT
The pure copper wires were wiredrawn at cryogenic and room temperatures. After deformation they presented important and significant differences in their crystallographic textures and microstructures. Therefore, this study aimed to investigate the evolution of crystallographic texture of pure copper drawn at temperatures of 295 K and 77 K and correlated them to the deformation micromechanisms. For this, the X ray diffraction (XRD) and electron backscattered diffraction (EBSD) techniques were used. The results showed that, after the deformation, the samples drawn at both temperatures showed Copper {112}<111>, X {110}<111> and Brass {110}<112> components as the most intense. In samples drawn at cryogenic temperature there was also observed the appearance of a R{124}<211> component, typical of recrystallization and the presence of the γ fiber {111}<uvw>, typical of deformation twin.
Keywords
copper drawn; 77K drawing; 295K drawing; microtexture; crystallographic texture
